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This study aims at evaluating the impact of pumpkin powder (12%) and Balangu seed gum (BSG) (0.00, 0.50, 1.00 and 1.50 %) on the physicochemical, rheology, textural properties and sensorial parameters of the sangak bread. First, the fresh pumpkin slices (5mm thickness) were dried (65°C) and samples were powdered and used in the sangak bread formulation. Pumpkin bread dough formulated with BSG showed pseudoplastic and thixotropic behaviour. The bread dough viscosity increased from 13.31 to 23.65 Pa.s with increasing BSG percent from 0.00 to 1.50 % (P<0.05). With increasing BSG concentration, the density of baked breads was reduced from 880.10 to 704.29 kg/m³. The surface color of samples was affected by addition of BSG. The pumpkin bread with 1.00 % BSG demonstrated a colour, with L*, a* and b* indexes equal to 65.38, 6.86 and 44.43, respectively. The weight, moisture content (MC) and volume values of breads increased from 52.83 to 57.02 g, 30.04 to 35.56 % and 65.38 to 80.99 cm³, respectively. BSG improved porosity of the breads and resulted in reduced baking loss and softer bread product. The sangak bread with 1.5% BSG had the best score of color, porosity and appearance, and the bread with 1% BSG had the highest satisfactory in terms of flavour, textural properties and total acceptance (P<0.05).